The Technology Behind
VIBE-EX

Patented KPD technology – physically precise, field-proven

Physical Principles

Understanding the fundamental physical principles that govern material behavior and the interactions between materials at the atomic level. Modification of physical properties.

Atomic Composition of Materials

All materials consist of atoms and molecules held together by electrical forces. These electromagnetic interactions between charged particles determine the fundamental mechanical, vibrational, and electronic properties of materials.

Atoms/Molecules

Fundamental building blocks of matter with positively charged atomic nuclei (protons, neutrons) and negatively charged electrons

Electric Forces

Electromagnetic interactions (Coulomb forces) between charged particles

Force Direction

Attractive/repulsive forces determine material cohesion

Derived Material Properties, Work Function

The strength of interatomic electrical forces directly influences three key material properties that are critical for engineering applications. The intrinsic work function is the fundamental electrical material property. Movement of electrons within the material.

Elastic Modulus

E

Resistance to elastic deformation under stress

σ = E · ε

Higher interatomic bond strength → higher elastic modulus → greater stiffness

Unit: GPa or N/m²

Natural Frequency

f₀

Fundamental vibrational frequency of atomic lattice

f₀ = (1/2π)√(k/m)

Stronger bonds → higher spring constant k → higher natural frequency

Unit: Hz

Electron Work Function

Φ

Minimum energy to remove electron from surface

Φ = E_vacuum − E_Fermi

Binding strength determines energy barrier for electron emission

Unit: eV (electron volts)

Contact Potential Difference (CPD)

When two different materials come into contact, a contact potential difference (CPD) arises due to their differing work functions. This phenomenon is fundamental to understanding interface behavior in electronic components and sensor applications.

Energy Band Diagram at Material Interface

Vacuum Level (Evac)

Reference energy for free electrons

Fermi Level (EF)

Highest occupied electron energy state

Work Function (Φ)

Energy needed to remove electron from surface

Contact Potential (VCPD)

Voltage difference at equilibrium

Key Relationship

VCPD = (ΦA − ΦB) / e

Electrons flow from lower to higher work function until Fermi levels align, creating an electrostatic potential difference at the interface.

Physical Mechanism

The work function (Φ) represents the minimum energy required to remove an electron from a material's surface. When materials with different work functions come into contact, electrons flow from the material with the lower work function to the material with the higher work function until equilibrium is reached. This creates a contact potential difference: VCPD = (ΦA − ΦB)/e

Functional Principle of the WZ Chips

How the WZ chip system converts mechanical energy through interactions at the physical level.

01

WZ Chip Structure

Chip with capacitors + resonant circuits + adhesive film

02

EM Interaction

Electromagnetic interaction begins at the contact surface

03

Ordering of free electrons, field-effect movement of the electron gas

Optimization of the elastic modulus + shifts in natural frequency

04

Vibration Reduction

Reduction of vibration amplitude achieved within the defined application target range.

Eddy Current Brake Analogy

Similar to how eddy currents create electromagnetic damping without physical contact, WZ chips optimize material properties through controlled electromagnetic interaction, reducing vibrations at the molecular level without adding mass or mechanical components, and without weakening the material's properties.

The electrical circuit elements, through the contact potential difference that arises between the WZ chip and the material, alter the elastic modulus and thereby influence the natural frequency. When these electric fields are accelerated by a mechanical motion of the material excited by external influences, additional magnetic fields are generated. These reduce the vibration amplitude of the moving material, similar to an eddy current brake.

No external power supply required

Simple adhesive application

No material modification required

Before: High Vibration

After: Reduced Vibrations

Flow Optimization

  • In addition to mechanical effects, the technology also influences the flow properties of gases and liquids.
  • Improved laminar flow, reduced turbulence

Differentiation from Conventional Solutions

Conventional Damping Technologies

Increases overall weight

Requires intervention in the system

Mechanical/passive solution

Structural modification

Complex installation

Pure hardware product

VIBE-EX WZ Chip

No increase in mass

Usable without structural modifications

No mechanical retrofitting required.

Simple application (adhesive bond)

Combined with analysis services

Tailored solutions and personalized applications.

Innovation Timeline

Four decades of research, validation, and real-world application

1980s
Germany

Discovery Phase

Discovery of the influence of programmable materials through electromagnetic interaction

1990s-2000s
Laboratory

Laboratory Validation

Extensive validation on machinery, ships, and railways. Proven effectiveness in industrial environments.

2000s
Elite Sports

Sports Application

Technology adapted for elite sports under the MKC™ / WizardStickers™ brand.

2010s
Liechtenstein

VIBE-EX Acquisition

Acquired by the VIBE-EX consortium, headquartered in Liechtenstein

2010-Present
Global

Continuous Development

Over 10 years of continuous research and development, with steadily growing application areas across various industries

40+
Years